FPC / Rigid-Flex (uwezo)
PCB ngumu (uwezo)
FPC / Rigid-Flex (uwezo)
| Kuhesabu safu | Safu 1-28 |  |
| Aina ya laminates | FR-4 (High Tg, Halogen Bure, Frequency ya Juu) PTFE, BT, Getek, msingi wa Aluminium, Msingi wa Shaba, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Unene wa bodi | 6-240mil | |
| Uzito wa shaba ya Max Base | 210um (6oz) kwa safu ya ndani 210um (6oz) kwa safu ya nje | |
| Ukubwa mdogo wa kuchimba mitambo | 0.2mm (0.008 ″) | |
| Uwiano wa vipengele | 12: 1 | |
| Ukubwa wa jopo kubwa | Sigle upande au pande mbili: 500mm * 1200mm, | |
| Tabaka nyingi: 508mm X 610mm (20 ″ X 24 ″) | ||
| Mstari wa upana / nafasi | 0.076mm / 0.076mm (0.003 ″ / 0.003 ″) / 3mil / 3mil | |
| Kupitia aina ya shimo | Blind / Kuzikwa / Kuziba (VOP, VIP…) | |
| HDI / Microvia | NDIYO | |
| Kumaliza uso | HASL | |
| Kiongozi HASL Bure | ||
| Kuzamishwa Dhahabu (ENIG), Bati ya kuzamishwa, Fedha ya kuzamishwa | ||
| Kihifadhi cha Udhibiti wa Kikaboni (OSP) / ENTEK | ||
| Kiwango cha Dhahabu (Dhahabu Ngumu) | ||
| ENEPIG | ||
| Mchovyo wa dhahabu, Unene wa dhahabu hadi 3um (120u ”) | ||
| Kidole cha Dhahabu, Kuchapishwa kwa Carbon, S / M inayoweza kusomeka | ||
| Rangi ya mask ya Solder | Kijani, Bluu, Nyeupe, Nyeusi, Safi, n.k. | |
| Impedance | Ufuatiliaji mmoja, kutofautisha, impedance ya mpangilio inadhibitiwa | |
| Eleza aina ya kumaliza | Njia ya CNC; V-Bao / Kata; Ngumi | |
| Uvumilivu | Uvumilivu wa Min Hole (NPTH) ± 0.05mm | |
| Uvumilivu wa Min Hole (PTH) ± 0.075mm | ||
| Uvumilivu mdogo wa muundo ± 0.05mm |
PCB ngumu (uwezo)
| Panga | Bidhaa | Uwezo |  |
|
| Kuhesabu safu | Rigid-flex PCB | 2 ～ 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Bodi | Dak. Unene | 0.08 +/- 0.03mm | ||
| Upeo. Unene | 6mm | |||
| Upeo. Ukubwa | 485mm * 1000mm | |||
| Shimo & Yanayopangwa | Shimo | 0.15mm | ||
| Shimo la Min | 0.6mm | |||
| Uwiano wa Vipengee | 10: 1 | |||
| Fuatilia | Upana / Nafasi | 0.05 / 0.05mm | ||
| Uvumilivu | Fuatilia W / S | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Shimo kwa shimo | ± 0.075mm | |||
| Kipimo cha shimo | ± 0.075mm | |||
| Impedance | 0 ≤ Thamani ≤ 50Ω: ± 5Ω 50Ω ≤ Thamani: ± 10% Ω | |||
| Nyenzo | Uainishaji wa Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Wasambazaji kuu wa Basefilm | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Ufafanuzi wa Coverlay | PI: 2mil 1mil 0.5mil | |||
| Rangi ya LPI | Kijani / Njano / Nyeupe / Nyeusi / Bluu / Nyekundu | |||
| PI Stiffener | T: 25um ～ 250um | |||
| Mchochezi wa FR4 | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Tape | 3M / Tesa / Nitto | |||
| Ulinzi wa EMI | Filamu ya fedha / Wino wa Shaba / Fedha | |||
| Kumaliza uso | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Imeachwa bure) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| Kupaka dhahabu ngumu | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Kiwango cha dhahabu | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Fedha ya kuzamisha | Ag: 0.1 - 0.3um | |||
| Kupaka bati | Sn: 5um - 35um | |||